Cu/Ti3SiC2复合材料的制备及微观结构

Cu/Ti₃SiC₂复合材料的制备及微观结构

孙小燕¹ ，汪江节² ，张国青¹ ，潘培道¹

（1.池州学院机电工程学院，安徽 池州247000；2.池州学院化学与材料工程学院，安徽 池州247000 ）

摘  要   Ti₃SiC₂是一种新型的结构陶瓷材料，有诸多优异性能。Cu 具有优良的导电和导热性能，耐压性能好且能分流，但有不能抗熔焊缺陷，利用Cu和Ti₃SiC₂组成复合材料，有望成为新型电接触材料。本文采用Cu粉为基体，Ti₃SiC₂粉为增强相，采用热压烧结方法制备的Cu/Ti₃SiC₂复合材料，显微分析观察其组织均匀，团聚少，综合性能较好，在电接触材料中有着巨大的应用前景。通过比较不同烧结温度下制备的样品，发现温度高于750℃，Cu和Ti₃SiC₂会发生反应，有TiSi₂等杂质产生，因此烧结温度为750℃最好。通过对不同体积配比烧结而成的Cu/Ti₃SiC₂材料性能测试，结果表明：材料的致密度和抗弯强度随着Ti₃SiC₂含量增加而下降。抗弯断裂后的断口形貌经SEM分析，当Ti₃SiC₂含量低时，断口呈均匀分布的韧窝；当Ti₃SiC₂含量增加时，断口呈穿晶断裂形态，使得复合材料弯曲强度较高且呈脆性断裂。

关键词  Cu/Ti₃SiC₂；烧结温度；制备；显微组织

中图分类号：TB333；TG115.21⁺5.3  

文献标识码：Adoi:10.3969/j.issn.1000-6281.2020.02-003

Preparation and microstructure of Cu/Ti₃SiC₂ composites

SUN Xiao-yan¹，WANG Jiang-jie²，ZHANG Guo-qing¹，PAN Pei-dao¹

（1.Chizhou University of Mechanical and Electrical Engineering, Chizhou Anhui 247000；2.Chizhou University of Chemistry and Materials Engineering，Chizhou Anhui 247000，China )

Abstract  Ti₃SiC₂ is a new structural ceramic material with many excellent properties. Cu has excellent electrical and thermal conductivity, good pressure resistance and shunt resistance, but it cannot resist fusion welding. The composite material composed of Cu andTi₃SiC₂ is expected to become a new type of electrical contact material. In this paper, Cu powder is used as the matrix and Ti₃SiC₂ powder as the reinforcing phase. Cu/Ti₃SiC₂ composite material is prepared by hot pressing sintering method. The microstructure of Cu/Ti₃SiC₂ composite material is uniform, less agglomeration and better comprehensive performance. By comparing the preparation at different sintering temperatures, it was found that when the temperature was higher than 750℃, Cu and Ti₃SiC₂would react, and TiSi₂ and other impurities would be produced, so the sintering temperature was 750℃. The Cu/Ti₃SiC₂ materials sintered with different volume ratios were tested, and the results showed that the density and bending strength of the materials decreased with the increase of Ti₃SiC₂ content. SEM analysis of fracture morphology after flexural fracture shows that, when Ti₃SiC₂ content is low, the fracture shows uniform distribution of dimple, and when Ti₃SiC₂ content increases, it presents a typical transgranular fracture form, resulting in higher bending strength and brittle fracture of composite materials.

Keywords  Cu/Ti₃SiC₂；sintering temperature；preparation；microstructure

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[1] YIN X H，LI M S，ZHOU Y C. Microstructure and mechanical strength of transient liquid phase bonded Ti₃SiC₂ joints using Al interlayer [J]．Journal of the European Ceramic Society，2007，27（12）：3539-3544．

[2] 高润丰，梅炳初，朱教群，等.  Cu/Ti₃SiC₂ 新型受电弓滑板材料的研究[J]. 稀有金属快报，2005，24(11): 16-20.

[3] XIE H，ZHANG P，LI Y Y.  Erosion of Cu-Ti₃SiC₂ composite under vacuum arc [J]. Vacuum，2015，114: 26-32.

[4] 彭宇，赵昕，徐世烺，等. 高温后超高韧性水泥基复合材料的微观结构特征研究[J]. 电子显微学报，2019，38（3）：236-244.

[5] DI S，GUO Y，LIAN Z，et al. Synthesis of Ti₃SiC₂ bulks by infiltration method [J]. Journal of Alloys and Compounds，2011，509（8）：3602-3605.

[6] 陈国新，刘艳，白华，等. 金刚石/铜复合导热材料的界面结构研究[J]. 电子显微学报，2017，36（6）:530-534.

[7] DANG W T，REN S F，ZHOU J S，et al. Influence of Cu on the mechanical and tribological properties of Ti₃SiC₂[J]. Ceramics International，2016，42（8）：9972–9980 .

[8] 尹洪峰，任耘，范强，等. 反应热压烧结法制SiC/Ti₃SiC₂复合材料及其性能[J]. 复合材料学报，2011，28(3)：69-73．

[9] 郑伟.  Cu-Ti₃SiC₂电接触材料的制备及其热稳定性研究[D].  广州：华南理工大学，2003.

[10] 张毅，周延春.  Ti₃SiC₂弥散强化Cu:一种新的弥散强化铜合金[J]. 金属学报，2000，36(6):662-666.

[11] 陈树涛.  Cu/Ti₃SiC₂真空触头材料的制备与电接触性能研究[D].  北京：北京交通大学，2009.

[12] ZHANG Y，SUN Z M，ZHOU Y C. Cu/Ti₃ SiC₂ composite: a new electrofriction material[J].  Mat Res Innovat , 1999，3（2）：80-84.